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to-52 One Window 1.0mm IC Electronic Components to Can Semiconductor Shielding Cover
[Oct 25, 2023]
Our company can undertake customer customization and processing of various metal parts, meeting customer requirements for product size and accuracy to Cap High-Precision ...
Company: Fuzhou Xinxu Technology Co., Ltd
to Cap IC Electronic Components High-Precision Semiconductor Shielding Cover Plate
[Oct 25, 2023]
Our company can undertake customer customization and processing of various metal parts, meeting customer requirements for product size and accuracy to Cap High-Precision ...
Company: Fuzhou Xinxu Technology Co., Ltd
Polyimide Film Tape for Electronic Component Manufacturing
[Aug 03, 2023]
Product Description Double side polyimide kape tape use polyimide film as carrier with double side silicone adhesive coated. It can be widely used in the manufacturing of ...
FSTN 128X64 LCD Display for Electronic Components
[Sep 15, 2022]
FSTN 128X64 LCD Display for Electronic Components Specification: EG12864 128x 64 Graphics COB LCD Module Display type: FSTN or STN Module Size: ...
Company: Xiamen Eshine Display Co., Ltd.
Tags: Lcd Display Oled | Lcd Display Monitor Tft | Tft Lcd Display Screen
Stn 128X64 LCD Display custom electronic LCD for Electronic Components
[Sep 15, 2022]
STN 128X64 LCD Display for Electronic Components Specification: EG12864 128x 64 Graphics COB LCD Module Display type: FSTN or STN Module Size: ...
Company: Xiamen Eshine Display Co., Ltd.
Tags: Lcd Display Tft Modules | Panel Mount Lcd Display | Tft Lcd Multimedia Display
Stn 192X64 LCD Display for Electronic Components
[Sep 15, 2022]
STN 192X64 LCD Display for Electronic Components Specification: EG12864 128x 64 Graphics COB LCD Module Display Type: FSTN or STN Module Size: ...
Company: Xiamen Eshine Display Co., Ltd.
Tags: Tft Lcd Display | Tft Lcd Display Panel | Custom Lcd Display
Die Casting Engine Components, Automotive, Electronic Hardware
[Aug 12, 2022]
Aluminum die casting machine Cold Chamber Die Casting Machine 125tonne 2 sets Cold Chamber Die Casting Machine 250tonne 2sets Cold Chamber Die Casting Machine 350tonne 2sets Cold ...
Company: Xiamen Stick Industry Co., Ltd.
Tags: Aluminum Die Casting Part | Aluminum Pump Die Casting | Die Casting Aluminum Cookware
Cqfp40 Black Ceramic Packaging IC Electronic Components High Precision Semiconductor Housing
[Nov 30, 2023]
Integrated circuit black ceramic low-temperature glass double row narrow body base Black ceramic low-temperature glass packaging is a technology that uses low melting point glass ...
Company: Fuzhou Xinxu Technology Co., Ltd
IC Electronic Components Sop Multi-Layer Ceramic 16 Wire Packaging Semiconductor Shell
[Nov 26, 2023]
Integrated circuit black ceramic low-temperature glass double row narrow body base Black ceramic low-temperature glass packaging is a technology that uses low melting point glass ...
Company: Fuzhou Xinxu Technology Co., Ltd
IC Electronic Components Sop Packaging 8-Wire Multi-Layer Ceramic Fusion Sealed Semiconductor Shell
[Nov 21, 2023]
Integrated circuit black ceramic low-temperature glass double row narrow body base Black ceramic low-temperature glass packaging is a technology that uses low melting point glass ...
Company: Fuzhou Xinxu Technology Co., Ltd
Multilayer Ceramic PGA Integrated Circuit IC Electronic Components Fusion Sealed Semiconductor Shell
[Nov 21, 2023]
Integrated circuit black ceramic low-temperature glass double row narrow body base Black ceramic low-temperature glass packaging is a technology that uses low melting point glass ...
Company: Fuzhou Xinxu Technology Co., Ltd
IC Electronic Components DIP Multilayer Ceramic Dual Row 14 Wire Packaging Shell
[Nov 14, 2023]
Integrated circuit black ceramic low-temperature glass double row narrow body base Black ceramic low-temperature glass packaging is a technology that uses low melting point glass ...
Company: Fuzhou Xinxu Technology Co., Ltd
Sop Packaging IC Electronic Components Multilayer Ceramic 14 Wire
[Nov 14, 2023]
Integrated circuit black ceramic low-temperature glass double row narrow body base Black ceramic low-temperature glass packaging is a technology that uses low melting point glass ...
Company: Fuzhou Xinxu Technology Co., Ltd
IC Electronic Components Sop Packaging Multi-Layer Ceramic 18 Wire
[Nov 14, 2023]
Integrated circuit black ceramic low-temperature glass double row narrow body base Black ceramic low-temperature glass packaging is a technology that uses low melting point glass ...
Company: Fuzhou Xinxu Technology Co., Ltd
Electronic Components IC Lead Frame Dual Row 40 Wire Chip Housing
[Nov 08, 2023]
Integrated circuit black ceramic low-temperature glass double row narrow body base Black ceramic low-temperature glass packaging is a technology that uses low melting point glass ...
Company: Fuzhou Xinxu Technology Co., Ltd
